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Vapor Chamber
CPU Vapor Chamber Heat Sink CPU Vapor Chamber Heat Sink
CPU Vapor Chamber Heat Sink CPU Vapor Chamber Heat Sink
CPU Vapor Chamber Heat Sink CPU Vapor Chamber Heat Sink

CPU Vapor Chamber Heat Sink

Introduction：
Vapor Chamber heat sink, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUS, and high performance ASICs.

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Product Introduction

 

Vapor Chamber Heat Sink, The vapour chamber consists of the housing, the wick and the working liquid. In the vapour chamber, the working liquid receives heat from a heat source and evaporates. The resulting vapour diffuses and flows to the condenser section where it is condensed and the condensate returns to the evaporation via the wick to continue the working liquid cycle. Based on this working principle, the vapour chamber carries heat continuously away from the heat source to the condenser.

This vapor chamber heatsink consists of stamping fin and vapor chamber, vapor chamber is soldered to stamping fin, then assemble spring and screw.

Pioneer Thermal can manufacture vapor chamber heatsink according to customer's drawing, or design vapor chamber heatsink based on customer's thermal input, then build prototype to verify the thermal performance.

CPU Vapor Chamber Heat Sink

Vapor chamber heat sink process:

vapor chamber heat sink process

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