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FSW-Processed Cold Plates in Electronics Cooling

Date：2025-05-22 

Friction Stir Welding (FSW) has emerged as a significant manufacturing process for cold plates used in electronics cooling. FSW (Friction Stir Welding)-processed cold plates are used in electronics cooling to join metal components, creating high-strength, solid-state joints for efficient heat transfer and structural integrity. This process avoids melting and melting-related issues, offering benefits like dimensional stability, fatigue resistance, and suitability for joining dissimilar metals. 
FSW-Processed Cold Plates

Advantages of Pioneer Thermal FSW Cold Plates
● High-quality welds with few defects (e.g., no porosity or cracks).
● Low distortion due to minimal heat input.
● Suitable for various metals (e.g., aluminum, magnesium, copper, titanium alloys).
● Environmentally friendly (no filler metals or shielding gases needed).
● Applications: Widely used in aerospace (aircraft structures), automotive (body parts), marine (hull structures), and electronics industries.

Applications of FSW Cold Plates in Electronics Cooling
● FSW-processed cold plates are used in various electronics cooling applications, including:
● High-Power Electronics: Cooling IGBTs, power MOSFETs, diodes, and other high heat-generating components.
● Electric Vehicles (EVs): Thermal management of battery packs, motor controllers, and onboard chargers.
● Data Centers: Cooling high-density computing equipment like servers, GPUs, and ASICs.
● Renewable Energy Systems: Cooling inverters for solar and wind power.
● Aerospace and Defense: Cooling embedded systems like radars, avionics, and power electronics.
● Medical Equipment: Thermal management in MRI machines, CT scanners, and laser systems.
● Industrial Automation: Cooling servo drives, motor controllers, and PLCs.
● Telecommunications: Cooling base stations, amplifiers, and routers.

Pioneer Thermal FSW Cold Plate Services
How to choose a suitable FSW Cold Plates for your project depends on the chip's heating power, as well as the corresponding size, making process and material. These are all system level design solutions. Perhaps, we are the system level design supplier for the cooling field that you just need.
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