Stamped Vapor Chamber Heat Spreader

Introduction：
Custom Stamped Vapor Chamber Manufacturer for Electronics Thermal Cooling Solution
● Professional DFM Design Support
● Prototype sample: 3–5 working days after drawing confirmation
● Mass bulk order: 7–12 working days based on order quantity

We will assign a sales from China, USA or Singapore, wherever is near you, to get in touch with you.

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PRODUCTS

DETAILS

Product Description

Custom Stamped Vapor Chamber Manufacturer for Electronics Thermal Cooling Solution
This stamped vapor chamber adopts integrated deep drawing stamping molding technology, made of high-purity copper alloy with fine brushed surface finish. Unique L-shaped irregular profile, built-in mounting boss holes, reserved assembly cutouts and liquid filling pin structure, realizing ultra-flat thin-profile heat spreading for compact electronic devices. Our vapor chamber eliminates traditional assembled welding seams, delivers uniform two-dimensional rapid heat dissipation to solve hot spot overheating issues of high-power chips, communication modules and industrial control hardware.

Operational Thermal Schematic: L-Shaped Vapor Chamber

Applications

● Data Center Servers, GPU Graphics Cards, AI Accelerator Modules
● 5G/6G Communication Base Station, RF Power Amplifier Modules
● Industrial Control Motherboard, High Power Drive Module
● Notebook PC, Tablet, Handheld Game Console Consumer Electronics
● Medical Detection Equipment, New Energy Power Control Unit

Manufacturing Capacity

Full-Chain R&D & Manufacturing of High-Performance Vapor Chambers

From thermal simulation to mass production, we master the entire process. Equipped with Class-100 leak detection, precision stamping lines, and in-house mold shops, we deliver complex integrated vapor chamber solutions with 20+ years of thermal expertise.
Pioneer Thermal Custom Capabilities & Manufacturing Process