Ultra-Thin Vapor Chamber

At Pioneer Thermal, we manufacture high-precision vapor chambers with thicknesses ranging from 0.25mm to 0.5mm, enabling seamless integration into today's most space-constrained devices. Whether you're developing a foldable smartphone, an AI-powered tablet, a thin gaming laptop, or a 5G telecom module, our ultra-thin vapor chambers deliver reliable, passive, and uniform heat spreading to ensure optimal performance and extended device lifespan.

● Ultra-Slim Profile — Thickness options down to 0.25mm, and 0.3–0.5mm models widely available to meet the demanding space limitations of modern electronic designs.
● Exceptional Thermal Conductivity — Equivalent thermal conductivity up to 6,000 W/m·K (copper ~401 W/m·K), enabling efficient heat dissipation from concentrated hotspots across the entire chamber surface.
● 2D Heat Spreading — Unlike linear heat pipes, the vapor chamber spreads heat in two dimensions, effectively eliminating multiple hot spots simultaneously.
● Lightweight Construction — Thin copper walls with optimized internal wick structures significantly reduce overall weight compared to solid metal plates of equivalent dimensions.
● Passive Operation — No moving parts or external power input required; fully silent and highly reliable for long-life applications.
● Flexible Size Customization — Maximum planar dimensions up to 200mm × 300mm, with heat dissipation capacity reaching up to 800W when combined with forced convection through fins. Heat flux density can reach up to 150 W/cm² at the heating zone.
● Sturdy yet Thin Enclosure — Engineered with internal support pillars to maintain structural integrity against external air pressure, ensuring consistent thermal performance even at sub-0.4mm thickness.
● Leak-Proof Sealing — Laser welding and precision brazing processes ensure hermetic sealing for long-term reliability in demanding environments.